Koch-Chemie's MICRO CUT PAD is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's MICRO CUT M3.02 and/or MICRO CUT & FINISH P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety.

COMPRESSION HARDNESS: 10 / ABRASIVENESS: 5